A special report published by Bloomberg in mid-April
2024 pointed out that Taiwan is using the advantages of its semiconductor
industry to enhance its international status and break through the diplomatic
blockade of mainland China. Through technical cooperation agreements with the
United States, Canada, France, Germany and other countries and the
establishment of a chip design training base in Prague, the Czech Republic,
Taiwan has accelerated its "chip diplomacy" strategy. In addition,
the opening of TSMC's new wafer fab in Kumamoto, Japan, and the establishment
of a wafer fab by Power Semiconductor Manufacturing Co., Ltd. in India in
cooperation with Tata Electronics, both show Taiwan's active expansion in the
global semiconductor field.
~ For detailed articles, please browse the pdf file ~